Electromechanical Integration Engineer - Air Vehicles

Anduril Industries is a defense technology company with a mission to transform U.S. and allied military capabilities with advanced technology. By bringing the expertise, technology, and business model of the 21st century’s most innovative companies to the defense industry, Anduril is changing how military systems are designed, built and sold. Anduril’s family of systems is powered by Lattice OS, an AI-powered operating system that turns thousands of data streams into a realtime, 3D command and control center. As the world enters an era of strategic competition, Anduril is committed to bringing cutting-edge autonomy, AI, computer vision, sensor fusion, and networking technology to the military in months, not years.

ABOUT THE TEAM

The Air Dominance & Strike Electromechanical Engineers are responsible for the mechanical packaging, interconnect architecture, and structural integration of avionics, power systems, and electro-optical payloads across Group 5 aircraft and our high-speed missiles. The team owns the full development lifecycle—from concept through qualification and flight operations—delivering rugged, high-performance electromechanical systems optimized for Size, Weight, Power, and Cost (SWaP-C).

US Salary Range

$132,000 - $175,000 USD

The salary range for this role is an estimate based on a wide range of compensation factors, inclusive of base salary only. Actual salary offer may vary based on (but not limited to) work experience, education and/or training, critical skills, and/or business considerations. Highly competitive equity grants are included in the majority of full time offers; and are considered part of Anduril's total compensation package. Additionally, Anduril offers top-tier benefits for full-time employees, including:

Benefits

At Anduril, we invest in our people. Our comprehensive, competitive benefits package (available at little to no cost to employees) ensures you’re supported in health, recovery, and whatever comes next. For more information, Explore Our Benefits .

Responsibilities

Design flight-critical enclosures, chassis, and mechanical packaging for high-density circuit card assemblies, battery systems, electro-optical payloads, and cable/harness assemblies.; Collaborate with electrical engineers to inform PCBA layout, define connector configurations, manage keep-out zones, route harnesses, and establish thermal and grounding interfaces.; Create detailed 3D models, drawing packages, and GD&T and tolerance stack-up analyses to ensure designs are optimized for assembly, serviceability, and high-yield manufacturing.; Conduct hand calculations and structural FEA, working with thermal and fatigue analysts to validate performance before committing to physical hardware.; Design hardware to survive aerospace environments and meet standards such as MIL-STD-810, MIL-STD-464/461, and DO-160 (vibration, shock, thermal extremes, moisture, and EMI/EMC).; Lead root-cause investigations and corrective actions for mechanical, environmental, or manufacturing anomalies found during qualification or flight operations.; Support design reviews (PDR/CDR) and drive execution of engineering deliverables across distributed, cross-functional teams including systems, hardware, software, manufacturing, test, and supply chain.

Requirements

B.S. or higher in Mechanical Engineering, Mechatronics, Aerospace Engineering, or equivalent experience.; 4+ years of experience in electronics packaging and/or electromechanical systems design in aerospace, defense, automotive, or robotics.; Direct experience designing hardware to MIL-STD-810 and MIL-STD-464/461 environmental and EMI/EMC standards.; Proficiency with 3D CAD (Siemens NX, SolidWorks, CATIA, or similar) for complex modeling, enclosure packaging, and harness routing.; Understanding of advanced manufacturing processes including CNC machining, sheet metal fabrication, casting, injection molding, and 3D printing, with hands-on prototyping experience.; Strong communication, collaboration, and teamwork skills across multi-site, multi-disciplinary teams.; Eligible to obtain and maintain an active U.S. Secret security clearance.

Nice to have

Extensive experience with Siemens NX and Teamcenter.; Familiarity with eCAD tools (Altium, Cadence Allegro) and harness design software (Siemens Capital, Zuken E3).; Practical understanding of bare-board PCB manufacturing, high-density interconnect (HDI) stackups, and SMT assembly standards (IPC-A-610/J-STD-001).; Advanced FEA and thermal simulation experience with tools such as Ansys Mechanical, Ansys Icepak, FloTHERM, or Ansys Sherlock.; Experience designing battery modules/packs or precision-aligned electro-optical/sensor payloads.; Active Top Secret DoD clearance.