Equipment Development Engineer – Wafer Bonding - Technology Development Group

As an Equipment Development Engineer on Micron's Wafer Bonding Equipment Development team, you'll help develop next-generation, first-of-a-kind (FAOK) wafer bonding equipment. We take new ideas from concept to hardware, work directly with equipment suppliers to push system capability, and ultimately put those solutions into technology development and manufacturing. This is a hands-on development role with significant technical ownership. You'll work on precision alignment, overlay, bonding, controls, mechanical systems, automation, equipment data, and new hardware. You'll work closely with process development, manufacturing, suppliers, and engineering teams across Micron.

Responsibilities

Own wafer bonding equipment performance, capability, reliability, availability, and productivity; Lead FAOK equipment, hardware, and subsystem development with suppliers; Drive improvements in overlay, alignment, bond-wave behavior, tool matching, defectivity, contamination control, and equipment stability; Develop equipment requirements, performance budgets, experiments, simulations, and data-driven solutions; Use modeling, automation, equipment data, and advanced analytics to understand system behavior; Lead equipment evaluations, installations, qualifications, upgrades, and major technical improvements; Help define the wafer bonding equipment and technology roadmap; Present technical recommendations and development strategies to engineering teams, suppliers, and leadership; Share expertise, mentor other engineers, and help build a wafer bonding engineering team; Demonstrate AI proficiency and use AI-enabled workflows and tools for equipment monitoring, troubleshooting, data analysis, and technical problem solving; Approximately 5–10% domestic and international travel may be required for supplier development and cross-site engineering collaboration

Requirements

Bachelor's degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics, or a related technical field; 4+ years of semiconductor equipment, process, manufacturing, or related engineering experience; Comfortable troubleshooting complex equipment; Ability to analyze data; Ability to work across engineering disciplines; Experience driving technical projects to completion; Experience with precision alignment, overlay, modeling, or complex electromechanical systems is highly valued

Nice to have

Experience with wafer-to-wafer fusion or hybrid bonding; Precision alignment and overlay; Motion control; Semiconductor equipment development; Python or MATLAB; Equipment data and SECS/GEM; Sensors and automation; FEA, DOE, PCA, or other modeling techniques; Direct development work with semiconductor equipment suppliers; MS or PhD; Experience leading technical programs across multiple organizations, suppliers, or sites; AI proficiency

Benefits

Choice of medical, dental and vision plans in all locations; Income protection benefit programs for illness or injury; Paid family leave; Paid time-off program; Paid holidays