Semiconductor Assembly Process Development Engineer

Our company actively drives technological innovation in semiconductor back-end processes, with a strong focus on next-generation packaging technologies such as Flip Chip and System-in-Package (SiP).

In rapidly growing fields—including AI, high-performance computing (HPC), automotive, and IoT—there is increasing demand for packaging solutions with higher density, enhanced reliability, and superior thermal performance. In response, we are accelerating the development of advanced technologies such as FCCSP (Flip Chip Chip Scale Package) and FCBGA (Flip Chip Ball Grid Array).

As device architectures become more complex and multifunctional, expanding our technological capabilities and strengthening our development organization are essential. To support this growth, we are seeking engineers with expertise in semiconductor back-end processes.

This role offers the opportunity to work at the forefront of innovation—developing high-density, high-heat-dissipation packages for AI/HPC, as well as high-reliability solutions for automotive and IoT applications—and to contribute to technologies that underpin transformative advancements such as AI and autonomous driving.

You will be responsible for technology development in semiconductor back-end processes, including assembly, packaging, and testing:

[Language]

- Japanese: Business-level proficiency required, with the ability to participate in meetings, engage in technical discussions, and communicate effectively with internal and external stakeholders
- English: Approximately TOEIC 700 level, with the ability to communicate effectively in a business environment, particularly in reading and writing

[WANT]

- Experience in developing packages for AI / HPC applications, particularly with a focus on high-reliability design
- Experience in the development of advanced packaging technologies such as FCBGA, FCCSP, or FCLGA
- Experience working with and meeting quality standards such as ISO or IATF

Responsibilities

Development and evaluation of advanced packaging technologies, including FCCSP and FCBGA; Material and process development, as well as improvement of assembly processes (e.g., molding, strip grinding, ball mounting, marking, and package sawing); Support for production line setup and transition to mass production; Driving process quality improvements and yield enhancement activities

Requirements

Minimum of 5 years of experience in technology development for semiconductor back-end processes (assembly and packaging); At least 5 years of experience in technology development in one or more of the following processes: Molding, Strip Grinding, or Package Sawing; Hands-on experience in process improvement, quality control, and equipment introduction/implementation; Bachelor’s degree or above in a technical field such as Mechanical Engineering, Materials Science, Electronics, Chemistry, or a related discipline