Semiconductor Package Electrical Design Engineer

【MUST】

【WANT】

- At least three years of practical experience in semiconductor package design at a semiconductor manufacturer
- At least three years of experience using electromagnetic field simulation tools such as HFSS and Q3D
- At least three years of experience using high-frequency circuit simulation tools such as ADS and HSPICE
- At least three years of experience in electrical characterization using VNAs, impedance analyzers, or similar equipment, or in EMC evaluation

Responsibilities

Lead semiconductor package design in collaboration with IC design engineers to optimize product cost and performance.; Lead the layout design of package substrates and printed circuit boards for reference designs for semiconductor products incorporating high-speed memory interfaces and high-speed serial communication circuits.; Investigate technology trends in semiconductor packages and printed circuit boards, and propose and develop design technologies required for next-generation products.; Take on a leadership role within the design team as your experience grows.

Requirements

Ability to understand the Renesas Culture principles of Transparent, Agile, Global, Innovative, and Entrepreneurial, and act in accordance with these values; At least three years of practical experience in semiconductor package design; At least three years of practical experience in high-speed or high-frequency electrical design