Senior Staff Package Design Engineer

Responsibilities

Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging.; Package technologies qualification for consumer & industrial power as well as automotive power applications.; Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).; Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.; Work with Product groups and Reliability team, qualify new packages and processes within required time frame.; Resolve all process integration issues by ensuring all window checks are done on critical process steps.; Establish production controls and monitor to ensure there is no room for quality incidents.; Ensure smooth transition into production & implement ramp up monitor.; Work with OSAT/CM to monitor and resolve process issues early in the production to ensure only parts with superior quality shipped to customer.; Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects.; Participate in packaging roadmap development & focus on execution.; Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.; Establish & maintain package design rules.

Requirements

Bachelors of Engineering Degree required in Physics, Chemistry, Mechanical, Electrical or Materials Engineering or a related field. Doctorate or Master's in is a plus.; 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging.; Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of wire-bonding & multi-chip module technologies a plus.; Strong interpersonal and communication skills.; Strong analytical and presentation skills.