Sr Device FA Engineer

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Responsibilities

Perform failure analysis (FA) on memory product defects identified during qualification, reliability testing, and customer return (RMA) investigations at both wafer and finished product levels.; Define and execute appropriate FA strategies, methodologies, and workflows for each failure case. Generate comprehensive FA reports and collaborate with Product, Design, Process, and Reliability Engineering teams to identify root causes and drive corrective actions.; Maintain FA case tracking systems, documentation, and ensure effective utilization and upkeep of FA equipment and laboratories.; Develop and enhance advanced FA methodologies, processes, and state-of-the-art failure analysis capabilities to support current and next-generation NAND technologies.

Requirements

Above 3 years of relevant experience in FA engineering field; Master's degree in Materials, Electrical Engineering, or a related technical field; Comprehensive knowledge of semiconductor manufacturing processes, memory product technology, and structure.; Thorough understanding of memory product test processes and methodologies.; Demonstrated proficiency in performing failure analysis using advanced tools and methodologies, including EFA, OBIRCH, EMMI, Delayering, SEM with EDX, or FIB/TEM.; Superior communication and presentation skills with fluency in English (speaking, reading, and writing).; Familiarity with memory theory and electrical failure analysis preferred.; Experience in NAND Physical Failure Analysis (PFA) and 3D NAND fabrication processes preferred; Preferred experience leveraging AI/ML, computer vision, or data analytics to automate FA workflows, accelerate defect localization and enhance root cause analysis.