Staff Process Engineer

Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.

Responsibilities

Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.; Ramp up manufacturing volume and qualify required sources.; Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.; Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.; Manage Product Lifecycle Management documents to the latest status.; Conduct change-management with suppliers to sustain / improve capacity and cost.; Partner with Quality and Reliability teams to meet internal, industry, and customer standards.; Serve as the key manufacturing engineering interface for NPI-to-production transfers.; Manage OSAT and contract manufacturing relationships supporting production.

Requirements

Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.; Minimum 5 years of experience in Assembly Engineering.; Experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.; Knowledge in quality / reliability requirements of PQFNs/QFNs and leaded packages.; Knowledge of wire bonding.; Knowledge of SPC and statistical analysis software (such as JMP).; Strong interpersonal and communication skills in English.; Strong analytical, written communication and presentation skills. Able to manage large projects effectively.

Nice to have

Cu Clip, Thin Die, Power QFN; Package development; Development-to-Production transfer; NPI-to-Mass Production support; Ultra-thin wafer handling & SPS solder attach; Taiko wafer technology