Substrate IC Package Layout Design Engineer

As a Substrate IC Package Layout Design Engineer you will be responsible for the end-to-end design of complex IC substrate packages, supporting high-power consumption and high-speed signaling. The ideal candidate will have extensive experience with large substrate designs (>50mm), complex power delivery networks, and high-speed signaling solutions (up to and beyond 50GHz). You will work closely with silicon, signal integrity, power integrity, and system help co-design world class substates with OSAT providers. Intense focus on optimization for power delivery through substrate, pushing what’s possible.

Responsibilities

IC Substrate Layout Design; Lead the design and development of complex IC substrate layouts for high-power AI processors and accelerators; Design large (>50mm) and complex multi-layer substrate packages with high pin counts and dense routing requirements; Ensure robust power delivery designs capable of supporting >700W custom silicon solutions; High-Speed Signal Routing & Integrity; Develop high-speed signal routing solutions capable of supporting >50GHz signaling while minimizing signal integrity issues such as loss and crosstalk; Collaborate with SI/PI engineers to define signal integrity and power integrity requirements and implement solutions in substrate layout; Advanced Packaging & CoWoS Integration; Optimize CoWoS (Chip-on-Wafer-on-Substrate) interposer designs for thermal and electrical performance; Work closely with chip design, packaging, and manufacturing teams to ensure design feasibility and manufacturability; Design Validation & Verification; Perform DRC (Design Rule Check) and LVS (Layout vs. Schematic) verification for all substrate designs; Develop and maintain design documentation and guidelines for future substrate designs; Support design reviews and provide technical guidance to junior team members

Requirements

Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field; 10+ years of experience in IC substrate layout design for high-performance processors or accelerators; Extensive experience with large substrate packages (>50mm) and complex high-density layouts; Proven experience with high-power (700W+) package designs and robust power delivery networks; Expertise in high-speed signaling design (>50GHz) and mitigating signal integrity challenges (crosstalk, reflections, impedance mismatches); Strong experience with CoWoS (Chip-on-Wafer-on-Substrate) interposer design and the impact of the substrate design to support CoWos; Advanced proficiency in Allegro Package Designer (including constraint management, routing, and design verification); Deep understanding of SI/PI principles and how they apply to package-level design; Strong analytical skills and ability to work effectively in a fast-paced, cross-functional team environment

Benefits

Medical, dental, and vision packages with generous premium coverage; $500 per month credit for waiving medical benefits; Housing subsidy of $2k per month for those living within walking distance of the office; Relocation support for those moving to San Jose (Santana Row); Various wellness benefits covering fitness, mental health, and more; Daily lunch and dinner in our office; Unlimited compute budget subject to ROI justification