Technician 3, Engineering

SanDisk is a global leader in NAND flash memory and advanced storage solutions , with a strong legacy of innovation in semiconductor technology. As an independent company focused on flash memory, SanDisk designs and manufactures cutting-edge NAND devices, SSDs, and storage solutions for data center, mobile, automotive, and consumer applications. With deep expertise in wafer fabrication, device design, and advanced packaging , SanDisk continues to drive the future of data storage.

We are seeking a Die Preparation (DP) Technician to support semiconductor backend and R&D activities through high‑quality die preparation processes , including wafer dicing and back grinding . This role is essential to ensuring die quality, yield, and readiness for downstream assembly, packaging, and engineering evaluation .

The position works closely with process engineering, package development, manufacturing, and R&D teams in a cleanroom and lab environment.

Responsibilities

Perform die preparation processes , including:; Wafer dicing (blade and/or laser, as applicable); Back grinding / wafer thinning; Set up, operate, and monitor DP tools and equipment according to defined process specifications.; Inspect wafers and dies for process quality and defects , and report abnormalities.; Support process development, optimization, and troubleshooting activities.; Maintain process documentation, logs, and sample traceability .; Perform routine tool checks, basic maintenance, and housekeeping .; Collaborate with process, package, and manufacturing engineers to support development and production needs.

Requirements

Diploma, Associate or Bachelor’s degree in Mechanical Engineering, Electronics, Materials, Manufacturing, or related technical fields , or equivalent hands‑on experience.; Hands‑on experience with die preparation processes is required.; Familiarity with wafer dicing and back grinding equipment .; Ability to work in a cleanroom environment .; Strong attention to detail and execution discipline.; Basic English communication skills for work instructions and documentation.

Nice to have

Experience with advanced semiconductor packaging or backend assembly processes.; Experience supporting NAND, ASIC, or advanced semiconductor products .; Familiarity with pilot line or R&D manufacturing environments .; Experience with process control and yield awareness .