jobs.pl/Stellenangebote/IT: Softwareentwicklung/SW SYSTEMS ENGINEER 10374 - Layer2 & Layer 3 Forwarding Development- BCM Chipset
Quelle: CrawlJobs
Für dieses Angebot liegt keine vollständige Übersetzung in der gewählten Sprache vor. Unten sehen Sie den Originalinhalt.

SW SYSTEMS ENGINEER 10374 - Layer2 & Layer 3 Forwarding Development- BCM Chipset

Extreme Networks Bangalore, Indien
Vollzeit Hybride Arbeit

Veröffentlichungsdatum: 31.08.2026

Experience: 5-8 Years • Strong understanding of networking data plane forwarding concepts in the following areas - L2, L3, VXLAN, MCT, ACL, QOS • Hands on experience of programming BCM based XGS & DNX family of chipsets is preferable. • Strong understanding of routing algorithms, data structures. • Strong understanding of control plane networking concepts • In-depth understanding of Linux operating systems and embedded software development • Excellent programming knowledge in C • Strong analytical and problem-solving skills • Exposure to GO and microservices architecture. • Experience in trouble shooting & debugging memory leaks, performance bottlenecks - • Experience working with multi-site project teams. • Ability to learn on the job and ready to take up challenges. • Should be able to implement and handle the complete delivery of the component/modules owned • Ability to be productive in flexible and dynamic work environments.

Responsibilities

Implement and handle the complete delivery of the component/modules owned

Requirements

Experience: 5-8 Years; Strong understanding of networking data plane forwarding concepts in the following areas - L2, L3, VXLAN, MCT, ACL, QOS; Strong understanding of routing algorithms, data structures; Strong understanding of control plane networking concepts; In-depth understanding of Linux operating systems and embedded software development; Excellent programming knowledge in C; Strong analytical and problem-solving skills; Exposure to GO and microservices architecture; Experience in trouble shooting & debugging memory leaks, performance bottlenecks; Experience working with multi-site project teams; Ability to learn on the job and ready to take up challenges; Ability to be productive in flexible and dynamic work environments.

Nice to have

Hands on experience of programming BCM based XGS & DNX family of chipsets
Beim Arbeitgeber bewerben

Ähnliche Angebote

Alle →

Cookie-Einstellungen

Jeder Zweck ist optional und standardmäßig deaktiviert. Sie können Ihre Einwilligung jederzeit widerrufen.

Wir zeigen Angebote in Ihrer Nähe