Source:
Publication date: 31/08/2026
Experience: 5-8 Years • Strong understanding of networking data plane forwarding concepts in the following areas - L2, L3, VXLAN, MCT, ACL, QOS • Hands on experience of programming BCM based XGS & DNX family of chipsets is preferable. • Strong understanding of routing algorithms, data structures. • Strong understanding of control plane networking concepts • In-depth understanding of Linux operating systems and embedded software development • Excellent programming knowledge in C • Strong analytical and problem-solving skills • Exposure to GO and microservices architecture. • Experience in trouble shooting & debugging memory leaks, performance bottlenecks - • Experience working with multi-site project teams. • Ability to learn on the job and ready to take up challenges. • Should be able to implement and handle the complete delivery of the component/modules owned • Ability to be productive in flexible and dynamic work environments.
Responsibilities
Implement and handle the complete delivery of the component/modules ownedRequirements
Experience: 5-8 Years; Strong understanding of networking data plane forwarding concepts in the following areas - L2, L3, VXLAN, MCT, ACL, QOS; Strong understanding of routing algorithms, data structures; Strong understanding of control plane networking concepts; In-depth understanding of Linux operating systems and embedded software development; Excellent programming knowledge in C; Strong analytical and problem-solving skills; Exposure to GO and microservices architecture; Experience in trouble shooting & debugging memory leaks, performance bottlenecks; Experience working with multi-site project teams; Ability to learn on the job and ready to take up challenges; Ability to be productive in flexible and dynamic work environments.Nice to have
Hands on experience of programming BCM based XGS & DNX family of chipsetsHow to apply
Apply online: https://www.jobs.pl/en/oferta/100050622/aplikuj
JOBS.pl · https://www.jobs.pl/en/sw-systems-engineer-10374-layer2-layer-3-forwarding-development-bcm-chipset-oferta-100050622



















