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Design Engineer
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Staff Design Verification Engineer
Renesas Electronics
United Kingdom, Edinburgh
03/09/2026
Full-time
On-site
Sr Staff Engineer – Analog/Mixed-Signal Design
Renesas Electronics
India, Indiranagar
03/09/2026
Full-time
On-site
Principal Analog Design Engineer
Renesas Electronics
United States, Duluth
03/09/2026
Full-time
Hybrid
Staff Package Design Engineer - Substrate 封装设计专家（基板方向）
Renesas Electronics
China, Shanghai
03/09/2026
Full-time
On-site
Staff Engineer, Physical Design
Renesas Electronics
India, Bengaluru
03/09/2026
Full-time
On-site
Senior Analog Design Engineer
Renesas Electronics
United States, Chandler
03/09/2026
Full-time
Hybrid
(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )
Renesas Electronics
Taiwan, Taipei
03/09/2026
Full-time
On-site
Engineer, Physical Design
Renesas Electronics
India, Bengaluru
03/09/2026
Full-time
On-site
Senior Staff Package Design Engineer
Renesas Electronics
United States, Tempe
03/09/2026
Full-time
On-site
Senior Staff Engineer, Digital Design (Power & Analog ICs)
Renesas Electronics
India, Bengaluru
03/09/2026
Full-time
On-site
Senior Staff Engineer, Physical Design
Renesas Electronics
India, Bengaluru
03/09/2026
Full-time
On-site
HPC SoC Timing Design Engineer/Leader
Renesas Electronics
Japan, Kodaira
03/09/2026
Full-time
On-site
Director of AI/ML Engineering (EDA & Semiconductor Design)
Renesas Electronics
India, Hyderabad
03/09/2026
Full-time
On-site
Principal Device Design Engineer
Renesas Electronics
United States, Austin
03/09/2026
Full-time
On-site
Sr. Engineer, Design Enablement
Renesas Electronics
India, Noida
03/09/2026
Full-time
On-site
HPC SoC Interconnect Design Engineer / Leader
Renesas Electronics
Japan, Kodaira
03/09/2026
Full-time
On-site
Principal Engineer-Physical Design
Renesas Electronics
India, Bengaluru
03/09/2026
Full-time
On-site
Sr UI/UX Design Engineer
Renesas Electronics
India, Bangalore
03/09/2026
Full-time
On-site
Principal Analog Design Engineer
Renesas Electronics
United States, Morrisville
03/09/2026
Full-time
Hybrid
Principal Package Design Engineer
Renesas Electronics
United States, San Jose
03/09/2026
Full-time
Hybrid
Senior Staff Engineer, Digital Design
Renesas Electronics
India, Bengaluru
03/09/2026
Full-time
Hybrid
(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )
Renesas Electronics
Taiwan, Zhubei
03/09/2026
Full-time
On-site
(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )
Renesas Electronics
Taiwan, Taichung
03/09/2026
Full-time
On-site
(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )
Renesas Electronics
China, Suzhou
03/09/2026
Full-time
On-site
Principal Device Design Engineer
Renesas Electronics
United States, Tempe
03/09/2026
Full-time
On-site
Staff Package Design Engineer - Cu FSM/BGBM/Bumping 封装设计专家
Renesas Electronics
China, Suzhou
03/09/2026
Full-time
On-site
Sr Mask Design Engineer
Renesas Electronics
India, Bengaluru
03/09/2026
Full-time
Hybrid
Principal Engineer, Power Management IC Designer
Renesas Electronics
United States, Morrisville
03/09/2026
Full-time
On-site
Dir, Package Design Engineering
Renesas Electronics
Taiwan, Taichung
03/09/2026
Full-time
On-site
Staff Package Design Engineer
Renesas Electronics
United States, Tempe
03/09/2026
Full-time
Hybrid
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