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Senior Staff Engineer, Analog Design (Power & Analog ICs)
Renesas Electronics
India, Bengaluru
03/09/2026
Full-time
On-site
Sr Physical Design Engineer
Renesas Electronics
India, Bengaluru
03/09/2026
Full-time
On-site
High-Speed I/F Subsystem Design Engineer
Renesas Electronics
Japan, Kodaira
03/09/2026
Full-time
On-site
(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )
Renesas Electronics
Taiwan, Kaohsiung
03/09/2026
Full-time
On-site
Staff Engineer, Physical Design
Renesas Electronics
India, Bengaluru
03/09/2026
Full-time
On-site
Associate Analog IC Design Engineer模拟芯片研发工程师（27年应届生岗）
Renesas Electronics
China, Tianjin
03/09/2026
Full-time
On-site
Sr Staff Engineer, Design Verification
Renesas Electronics
India, Bengaluru
03/09/2026
Full-time
Hybrid
Senior Staff Engineer, Analog Design
Renesas Electronics
India, Bengaluru
03/09/2026
Full-time
Hybrid
Staff Package Design Engineer
Renesas Electronics
United States, Austin
03/09/2026
Full-time
Hybrid
Director, Package Design Engineering
Renesas Electronics
United States, Phoenix
03/09/2026
Full-time
On-site
Staff Engineer - Design Verification
Renesas Electronics
India, Bengaluru
03/09/2026
Full-time
On-site
Principal Analog Design Engineer
Renesas Electronics
United States, Chandler
03/09/2026
Full-time
Hybrid
Principal Engineer, RTL Design
Renesas Electronics
India, Noida
03/09/2026
Full-time
On-site
Staff Digital Design Engineer
Renesas Electronics
Taiwan, Zhubei
03/09/2026
Full-time
On-site
(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )
Renesas Electronics
China, Shanghai
03/09/2026
Full-time
On-site
Principal Digital Design Engineer
Renesas Electronics
United States, San Jose
03/09/2026
Full-time
On-site
Staff Engineer, Design Verification
Renesas Electronics
India, Bengaluru
03/09/2026
Full-time
On-site
Principal Device Design & Integration Engineer
Renesas Electronics
United States, San Jose
03/09/2026
Full-time
On-site
Staff Package Design Engineer - Cu FSM/BGBM/Bumping 封装设计专家
Renesas Electronics
China, Suzhou
31/08/2026
Full-time
On-site
Staff Package Design Engineer - Substrate 封装设计专家（基板方向）
Renesas Electronics
China, Shanghai
31/08/2026
Full-time
On-site
Staff Package Design Engineer - Substrate 封装设计专家（基板方向）
Renesas Electronics
China, Suzhou
31/08/2026
Full-time
On-site
Staff Package Design Engineer - Cu FSM/BGBM/Bumping 封装设计专家
Renesas Electronics
China, Shanghai
31/08/2026
Full-time
On-site
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