[EMN] Expert for High-Performance SoC BSP Integration (with Joining Bonus)

As an Expert for High-Performance SoC BSP Integration, you will play a key role in building and integrating the foundational software stack for next-generation high-performance System-on-Chip (SoC) and Chiplet platforms. You will work deep within BSP, POSIX/Linux/QNX environments, developing and optimizing kernel modules and device drivers, porting low-level software across platforms, and enabling reliable integration with high-speed interfaces such as PCIe and UCIe. With hands-on expertise spanning bootloaders, Linux kernel, device drivers, and SoC architecture, you will contribute to the performance, scalability, and technical excellence of Bosch's Automotive Chiplet Systems (ACS) project.

Responsibilities

Develop advanced software modules and drivers specifically for the POSIX operating system (e.g. QNX); Design and develop robust Linux kernel modules; Port existing Linux drivers (kernel and user Space) to specific Linux distribution environment to ensure seamless integration and functionality; Develop and contribute to multi-layer Continuous Integration (CI) environments; Build and integrate the foundational software stack for next-generation high-performance System-on-Chip (SoC) and Chiplet platforms; Develop and optimize kernel modules and device drivers, port low-level software across platforms, and enable reliable integration with high-speed interfaces such as PCIe and UCIe

Requirements

Bachelor's or Master's degree in Computer Science, Software/Electrical/Computer Engineering, or related fields; 8+ years of embedded software development experience, particularly in BSP, kernel, and device-driver development; Strong C/C++ programming skills; Strong hands-on experience with Embedded Linux, Linux Kernel, device drivers, BSP, ARM Cortex-A, and bootloaders; Experience with Linux, QNX, or other POSIX-based operating systems; Good understanding of high-performance SoC architectures, memory hierarchies, and high-speed interfaces such as PCIe; Strong debugging skills using GDB, Lauterbach, or similar tools; Good knowledge of Git; Fluent English communication skills

Nice to have

QNX BSP development or bring-up experience; Experience with Android, hypervisors, virtualization, or multi-core SoCs; Experience with PCIe, Ethernet, or UCIe; Automotive embedded software and ISO 26262 knowledge; Experience deploying AI/ML on embedded platforms; Knowledge of GNU toolchains and Requirements Engineering tools such as Codebeamer; German language skills

Benefits

Joining Bonus equivalent to 1 month gross salary (subject to program eligibility and terms & conditions, join by 31 December 2026); 13th-month salary bonus; Attractive performance bonus; Annual performance appraisal; 100% offered salary and mandatory social insurances in 2-month probation; 15++ days of annual leave; 1-day of birthday leave; Premium health insurance for employee and 02 family members; Flexible working time and working model; Lunch and parking allowance; Onsite opportunities in worldwide offices; Diverse training programs; Company activities such as football, badminton, yoga, aerobics, team building