Engineer, Process Integration and Yield Engineering

The Engineer, Process Integration & Yield Engineering, is responsible for developing, sustaining, and improving semiconductor manufacturing technologies to achieve industry-leading yield, quality, cost, and cycle-time performance. This role drives process integration, yield enhancement, technology characterization, and production problem-solving activities across the wafer fabrication process flow. The engineer works closely with process module engineering, device engineering, manufacturing, quality, reliability, and failure analysis teams to identify yield limiters, resolve integration challenges, and implement robust manufacturing solutions. Candidates without prior work experience are welcome to apply. Comprehensive training and development will be provided.

Responsibilities

Own and manage process integration activities for assigned technology platforms, products, or process modules; Develop, optimize, and sustain integrated process flows to meet yield, performance, reliability, and manufacturability requirements; Drive technology development and manufacturing readiness from engineering development through high-volume production; Evaluate process interactions and integration impacts across multiple fabrication modules; Perform comprehensive yield analysis using electrical test, inline metrology, defect inspection, and reliability data; Identify yield detractors, determine root causes, and implement corrective actions to improve manufacturing performance; Develop and execute yield improvement roadmaps to meet business and customer objectives; Apply statistical techniques to monitor, analyze, and improve process capability and yield performance; Perform advanced data mining and correlation analysis to identify process and yield improvement opportunities; Lead root-cause investigations involving process excursions, yield loss events, and reliability issues; Utilize SPC, DOE, regression analysis, and statistical methodologies to drive engineering decisions; Develop automated dashboards, reports, and analytical tools to improve engineering efficiency; Collaborate with process module, manufacturing, test, reliability, design, and packaging teams to resolve technical issues; Partner with Failure Analysis (FA) teams to determine physical root causes of yield and reliability problems; Support customer engagements and technology reviews as required; Lead or participate in cross-functional continuous improvement projects; Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Requirements

Bachelor's Degree in Electrical Engineering, Electronics Engineering, Materials Science, Physics, Chemical Engineering, Semiconductor Engineering, Microelectronics or other related engineering disciplines

Nice to have

Prior related internship or co-op experience; Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.; Project management skills, including the ability to innovate, execute on solutions and navigate ambiguity; Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows and support decision-making; Strong understanding of semiconductor device physics and CMOS manufacturing processes; Knowledge of semiconductor process modules; Proficiency in yield analysis, defectivity analysis and process integration methodologies

Benefits

Meaningful learning experiences; Cross-functional collaboration; Professional development; Mentorship; Networking; Leadership opportunities; Support for skill development, career progression, and long-term success; Comprehensive training and development