【Gunma】Semiconductor Assembly Mass Production Engineer

We are seeking an experienced back-end assembly engineer specializing in FCBGA and WLCSP, including support for the R-CAR series, one of Renesas’ key automotive product lines.

The successful candidate will initially take primary technical responsibility for FCBGA/WLCSP products manufactured at both domestic and overseas internal manufacturing sites and OSATs. In the future, the scope of responsibility is expected to expand to cover a broader range of flip-chip package technologies, including Chiplet packages.

As a significant portion of the products are manufactured by overseas OSATs, we expect the candidate to take a proactive approach to communication and collaboration in both Japanese and English.

We are ideally looking for an experienced professional who can make an immediate contribution. At the same time, strong support will be available from the experienced direct manager, and we welcome someone who is motivated to contribute to the team and continue growing together with us.

Lead Assembly Process Engineer for FCBGA/WLCSP, responsible for assembly engineering from development through mass production.

*The full details regarding your position scope as well as any future potential changes in work location and job scope will be provided during the interview process.

Hands-on experience in the following areas

- Yield/quality/cost improvement for FCBGA.
- Yield/quality/cost improvement for WLCSP.
- Yield/quality/cost improvement for Assembly processes.
- Troubleshooting and issue resolution for Assembly processes.
- Coordination with overseas subcontractors/OSATs.

Responsibilities

Development: Technical verification and review of development results.; Mass Production: Assembly yield, cost, and quality improvement activities, management of product/process changes, and coordination with relevant functions.; Issue Resolution: Development and technical review of root cause and corrective actions, coordination with Quality Assurance, and customer support.

Requirements

Business-level communication skills in Japanese and conversational skills in English for daily communication (TOEIC score of approximately 600).; Basic knowledge of semiconductor back-end processes.; Relevant work experience in the following areas:; Yield/quality/cost improvement related to Assembly process.; Troubleshooting and issue resolution related to Assembly process.