Process Engineer

We are seeking a Process Engineer with a minimum of 2 years of hands-on experience in semiconductor back-end assembly processes , particularly die bonding and wire bonding . The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance.

The role requires strong technical understanding of back-end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations.

Additional Advantage

- Experience with QFN, or similar packages is added advantage.
- Knowledge of yield improvement, reliability testing, and failure analysis
- Exposure to automation, equipment setup, and process optimization

Responsibilities

Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements; Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues; Support new product introduction (NPI), process qualification, and transfer to mass production; Establish and maintain process parameters, work instructions, and control plans; Analyze process data using statistical methods (e.g. SPC, CPK, trend analysis); Collaborate with cross-functional teams including Production, Quality, Equipment, and R&D; Drive continuous improvement activities for cost, yield, cycle time, and reliability

Requirements

Bachelor’s degree in Engineering (Materials, Mechanical, or related field); Minimum 2 years of experience in semiconductor back-end assembly; Strong knowledge of die bonding and wire bonding processes; Familiarity with back-end materials such as leadframes, substrates, adhesives, and bonding wires; Experience with process characterization, DOE, and data analysis is an advantage; Good problem-solving, communication, and teamwork skills.