Senior Packaging Engineer

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

We are looking for a hands-on Packaging Engineer to support SSD package development from concept through qualification and high-volume manufacturing. This role will work closely with global design, reliability, process, operations, OSAT, and supplier teams to deliver innovative, manufacturable, and reliable packaging solutions.

Responsibilities

Support SSD package development from concept, design validation, qualification, and high-volume manufacturing ramp.; Review package design drawings and provide feasibility feedback, DFX input, and improvement recommendations.; Collaborate with global engineering, reliability, process, operations, OSAT, and supplier teams to ensure design implementation and manufacturing readiness.; Support engineering builds, characterization, package qualification plans, and risk mitigation activities.; Monitor assembly and test yield, support failure analysis, and drive corrective and preventive actions.; Contribute to assembly process flows, work instructions, FMEA/PFMEA, control plans, process recipes, and SPC monitoring.; Support the introduction of new packaging technologies, materials, and processes into production.

Requirements

Master’s degree or higher in Materials Science, Manufacturing, Mechanical Engineering, Packaging Engineering, or related engineering disciplines.; 3–5 years of relevant experience with a master’s degree, or 0–3 years with a PhD.; Strong understanding of SMT, PCBA, PCB layout, solder joint reliability, board-level reliability, packaging materials, and failure analysis.; Experience with DOE, statistical analysis, structured problem solving, and tools such as Minitab, JMP, or equivalent.; Ability to work effectively in a fast-paced, cross-functional, global environment with strong communication and execution skills.

Nice to have

Excellent written and communication skills, enabling collaboration with global functional teams; Knowledge of thermo-mechanical aspects of semiconductor packages; Knowledge in data analytics or AI/ML techniques is a plus.