Senior Process Engineer (Die Prep)

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Responsible for developing, sustaining, optimizing, and troubleshooting manufacturing processes to achieve quality, yield, cost, reliability, and productivity targets. The Process Engineer drives process stability, supports production, leads problem-solving activities, and implements continuous improvement initiatives.

Key Roles & Responsibilities

1. Process Ownership & Support

- Own and support assigned manufacturing processes.
- Monitor process performance, yield, quality, and productivity metrics.
- Provide daily technical support to manufacturing operations.

2. Yield & Quality Improvement

- Drive yield improvement and defect reduction activities.
- Perform commonality analysis across product, process, machine, material, and measurement factors.
- Investigate excursions and abnormal events to prevent recurrence.

3. Problem Solving

- Lead structured root cause investigations using methodologies such as:
- 5 Why
- 8D
- DMAIC
- FMEA
- SPC/APC Analysis
- Implement corrective and preventive actions and verify effectiveness.

5. Capacity, Cost & Productivity Improvement

- Identify and implement cost reduction opportunities.
- Improve equipment utilization, throughput, and manufacturing efficiency.
- Drive productivity improvement projects and process optimization.

6. Risk & Compliance Management

- Conduct risk assessments for process changes.
- Ensure compliance with quality, safety, and manufacturing standards.
- Support change management activities and qualification requirements.

7. Cross Functional Collaboration

- Work closely with:
- Manufacturing
- Quality
- Equipment Engineering
- Failure Analysis
- Production
- NPI Teams
- Lead technical discussions and drive issue resolution across organizations.

Requirements

Bachelor's Degree in Engineering (Mechanical, Electrical, Electronics, Manufacturing, Materials, or equivalent).; Minimum 5-8 years of experience in semiconductor manufacturing/process engineering.; Strong knowledge of manufacturing process control, SPC, FMEA, DOE, and statistical analysis.; Experience in process improvement, yield enhancement, defect reduction, and productivity improvement projects.; Experience in root cause analysis and problem-solving methodologies such as 8D, 5 Why, Fishbone, and DMAIC.; Good understanding of quality systems and manufacturing standards.; Experience working in cross-functional teams involving Production, Equipment, Quality, and Development teams.; Strong communication and technical documentation skills.; Ability to lead projects independently and drive corrective actions to closure.; Advanced problem-solving and analytical skills.; Project management and stakeholder management.; Statistical data analysis and interpretation.; Process optimization and control.; Risk assessment and mitigation.; Effective written and verbal communication.; Technical report writing and presentation skills.; Leadership and coaching capabilities.; Continuous improvement mindset.; Ability to work in a fast-paced manufacturing environment.

Nice to have

Degree or Master’s Degree in Engineering or related field.; Experience in semiconductor backend assembly, die preparation, die attach, wire bond, molding, singulation, AOI, test or related manufacturing processes; Experience with automation, machine learning applications, APC, Industry 4.0 initiatives, or digital transformation projects.; Knowledge of reliability testing and failure analysis techniques.; Experience leading engineering teams or mentoring junior engineers.; Familiarity with SAP, MES, JMP, Minitab, Power BI, Tableau, or similar analytical tools.; Certified Six Sigma Green Belt or Black Belt.SKILLS