Staff Board Package Design Engineer

Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world leading MCUs, SoCs, Analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you.

Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world.

We are looking for an experienced leader for high performance SOCs/MCUs, for board and packaging group.

Responsibilities

Highly experienced in board and package design from block level to final board and package delivery.; Should have the ability to work independently with little supervision and drive the team to define, develop and execute the product plan from specification to release.; Must be a natural team player and strive towards fostering a highly creative and productive working environment

Requirements

MTech/BTech in EC/ EE/CS with hardware engineering experience of 7 to 10 years.; Experience in Microcontroller and Microprocessor based complex design; Experience in latest packaging Technologies and Manufacturing process; Strong domain knowledge of system clocking, system modes, power management, debug

Nice to have

Board level System architecture and design includes memory or communication interfaces.; SOC specifications and board level system specifications.; Development and design of SOC power supply, system power supply specifications, and PMIC specifications.; Interface specifications incorporating SOC-peripheral devices; Experience with high-speed interface i.e. PCIe Gen3/4/5/, LPDDR 4/4x/5/5x, UFS, Ethernet, Flash memory; Board level DC/AC simulations.; Schematic, Layout and BOM generation using modern CAD tools; Experience with SoC Bring-up activities; Familiarity with PCB technologies, DFM, DFA, materials, stackup design, assembly rules and manufacturing process; Experience with tools: Ansys HFSS or Cadence SI/PI, or other SI/PI, Cadence APD (Allegro Package Designer) for IC package layout design, SIwave, HSPICE, ADS, Q3D; Experience in IC packaging layout design, emphasizing advanced technologies like SiP (System-in-Package), flip-chip, and 3D packaging.; Comprehensive knowledge of packaging design aspects, encompassing power distribution, thermal control, and signal fidelity. Thermal simulation experience is added advantage.; Profound understanding of semiconductor manufacturing methodologies and packaging assembly processes; Ability to automate the SI, PI and Packaging activities using scripting tools like Python, TCL