Staff Engineer, Packaging Engineering

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Our Package Design Engineering team is seeking a talented Staff Engineer with expertise in thermal management, based at our Bangalore site. In this role, you will be pivotal in driving innovation in thermal design for our high-performance flash products, as well as developing and maintaining advanced simulation tools.

Responsibilities

Work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.; Innovate thermal management solutions for high-performance flash products; Enhance and maintain our modeling and simulation infrastructure to improve efficiency and accuracy across the design and manufacturing processes.; This position may interface with package & product design, electrical, thermal and physical characterization, reliability testing, failure analysis, assembly R&D and other process teams.

Requirements

Ph.D. in Mechanical Engineering, or M.S. in Mechanical Engineering plus >2 years of relevant industrial experience.; Solid knowledge through academic coursework or research experience required in thermal engineering.; Working knowledge in designing and conducting thermal testing and/or using a commercial CFD/FEA package.; Strong analytical and quantitative problem-solving ability; Good communication, relationship skills and a team player

Nice to have

Knowledge in thermal, structural or mechanical in package engineering; Interested in semiconductor industry.