3D Heterogeneous Integration Development Intern (Summer 2027)

The 3D Heterogeneous Integration Development Intern will contribute to advanced packaging and process-integration development, including wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, through-silicon via/through-oxide via (TSV/TOV), and interposer technologies. The intern will work with engineering teams to conduct experiments, analyze technical data, model processes, and support daily integration and process-development activities.

Responsibilities

Plan and perform design of experiments (DOEs) using internal semiconductor tooling and equipment at external partners; Analyze and interpret engineering data from experiments, process optimizations, and characterization activities; Develop or support process models to improve understanding of advanced packaging and integration performance; Assist engineers with daily integration, process-development, documentation, and technical problem-solving activities; Collaborate with process, materials, equipment, characterization, and external partner teams to support project objectives; Summarize experimental results and communicate technical findings and recommended next steps to project stakeholders; Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Requirements

At least a sophomore at time of application and actively pursuing a Bachelor's or Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or related field through an accredited degree program during the internship; Must have at least an overall 3.0 GPA and be in good academic standing; Language Fluency - English (Written & Verbal); Travel - Up to 10%; Ability to work at least 40 hours per week during the internship

Nice to have

Prior related internship or co-op experience; Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.; Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making; Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity; Strong written and verbal communication skills; Strong planning & organizational skills; Currently pursuing a PhD in Engineering or related field through an accredited degree program during the internship; Experience with advanced semiconductor packaging, semiconductor integration, hybrid bonding, TSV/TOV, interposers, design of experiments, or engineering data analysis; Availability for a six-month co-op assignment is preferred

Benefits

One-on-one mentorship; Work assignments that prioritize growth and potential; Professional development opportunities; Chance to network with executives