Assembly and Interconnect Technology (AIT)

Research, develop and implementation of Assembly and Interconnect Technology (AIT) processes for electronic modules such as sealing, thermal management, component fixation, electronics protection (conformal coating, potting, molding) and surface treatment (plasma, laser finishing, wet chemical cleaning etc.).

Responsibilities

Research, develop and implementation of Assembly and Interconnect Technology (AIT) processes for electronic modules such as sealing, thermal management, component fixation, electronics protection (conformal coating, potting, molding) and surface treatment (plasma, laser finishing, wet chemical cleaning etc.); Preparation of process development plan, estimation of effort, time & sample demand and release of contracting; Collaborating with the design team by analyzing product design & drawings and providing key insights to ensure the design is optimized for manufacturing and assembly (DFMA); Defining DOEs, plan & conduct trials, analyzing the results and create detailed technical documentation; Conducting technical reviews and active contributions in DFMEA, PFMEA & DFMA reviews to identify and mitigate risks early in the development cycles; Release of process specification for manufacturing, proving process capability; Defining, optimizing, and scaling up processes for series production; Coordinate development tasks with internal and external interfaces, including design teams, project management, suppliers, manufacturing plants, and customers to ensure seamless integration and alignment; Deviation assessment, risk estimation and provide risk assessment to project; Collaborating with international specialized and competence teams; Collaborating with production plant for series support

Requirements

Proven experience in one or more of the following: ECU sealing, thermal management for electronics, component fixation techniques, or electronics protection (conformal coating, potting, over molding); Strong understanding of surface treatment methods (plasma, laser, wet chemical cleaning); Practical experience with quality and risk analysis tools such as DFMEA, PFMEA, and DFMA; Good knowledge on Plastics or die cast or sheet metal; Good understanding of statistical methods and hands on experience; B.Tech/B.E/M Tech Electronics and Communication/Electrical engg; B.E/B.Tech in Material science (preferred) or Mechanical engineering; 3-5 years of hands-on experience in electronics packaging, assembly processes, or interconnection technology development; Good problem-solving & analytical skills and method knowledge; Self-driven and initiative, quick learner and passionate to work in the challenging environment; Strong communication and interpersonal skills, with the ability to work effectively in cross-functional teams; Team player with product-centric mindset

Nice to have

Familiarity with automotive industry standards and validation requirements; Experience with CAD visualisation software (Team center) and statistical tools (Minitab); German language A1