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Packaging Development Engineer (Only for New College Graduates)

Sandisk Shanghai, China
Full-time On-site work

Publication date: 29/08/2026

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Responsibilities

Packaging Development Engineer; New technology, material and equipment design, development and deployment in co-operation with internal and external team.; New product design, development and deployment until product move to mass production.; Bring innovation solution and technology across new technology and new product development.; Team work in English language with a multitude of international interfaces is mandatory.

Requirements

Master degree with major in material science / Mechatronic Technology as priority.; Preferred intern in assembly technology especially in SanDisk or similar company.; Passion for developing technical solutions in multidisciplinary international projects; Excellent English skills (verbal and written), willingness to travel as required.
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