Physical Design Engineer II

Join Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) as a Physical Design Engineer on the semiconductor design team, responsible for physical design implementation and physical integration to support development of cutting-edge semiconductor products for Microsoft's cloud infrastructure. Occasional travel may be required.

Responsibilities

Physical Design tasks at block, subsystem, sub-chip, and/or full-chip level; Physical design implementation and physical integration efforts; Tasks including Floorplanning, Synthesis, Placement, CTS and custom clocking, Routing, Static Timing, Physical Verification, Formal Equivalency, Power Efficiency, IR-Drop, and EM; Physical Design flow development/automation and evaluation of technology, IP, and vendor selection; Work with limited direction and provide crisp status of progress, issues, and risks to management

Requirements

Bachelor's or master's in electrical or computer engineering or related field with 6+ years of experience; Experience in physical design implementation, signoff at block / sub system / sub-chip / SoC level; Experience in tapeouts of complex ASICs in leading edge technology; Ability to meet Microsoft, customer and/or government security screening requirements