Principal Engineer, Packaging Engineering

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Responsibilities

Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified, and introduced into production in a timely manner while meeting all mechanical, electrical, performance, reliability, and quality requirements.; Lead cross-functional teams, factories, and other engineers while managing the entire package life cycle process.; Works with the Packaging R&D teams worldwide to develop and qualify new and emerging packaging technology required to support business needs; Support assembly yield improvement and package cost reduction programs.; Lead new product from low volume to high volume production transition with yield and quality meeting goals. Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production.; Work on innovative ideas for best-in-class package design.

Requirements

Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics or other engineering disciplines.; Master’s degree with more than 8 years of relevant work experience, or PhD degree with over 6 years of work experience. Bachelor's with 10+ Years.; Proficient in product management and strong knowledge of material properties used in packaging process such as in areas like die attach, wire bond, wafer thinning, and molding.; Familiarity with statistical tools and failure analysis approach; Knowledge in Machine learning and data analytics utilizing AI is a plus; Excellent written and communication skills, enabling collaboration with global functional teams; Knowledge of thermo-mechanical aspects of semiconductor packages