Process Engineer 2

As a Process Engineer at Lam, you will operate on cutting-edge technology, harnessing atomic precision, material science, and surface engineering to push technical boundaries. Your role involves developing new and advanced process formulations, defining equipment hardware to meet processing requirements, evaluating test data, and coordinating design requirements to ensure compatibility of processing methods. Your expertise and knowledge play a crucial role our customers success, making an impact on the next generation of semiconductor breakthroughs.

Responsibilities

Conduct process engineering research, development, and evaluation in support of Lam’s cutting-edge semiconductor equipment and systems; Review and enhance processing techniques and methods applied in the manufacture and fabrication of products; Develop and sustain new processes and process improvements to reduce production costs and increase yields; Compile and analyze test data to establish next steps in process development and determine appropriate limits and variables for process specifications; Collaborate internally to plan, collect data, analyze results, and report on customer demos for existing process applications.

Requirements

Bachelor’s degree and a minimum of 2 years of related experience; or a Master’s degree or PhD in Materials Science, Chemical Engineering, Chemistry or Physics or related field with no previous professional experience; or equivalent experience; This is a graduate eligible role.

Nice to have

Familiarity with working in a laboratory and on semiconductor equipment with experience in surface preparation and analytical techniques; In-depth understanding of Statistical Process Control (SPC) and/or Design of Experiments (DOE); Proficient in MATLAB, Python, or other similar scientific computing languages; Working knowledge of statistical analysis and problem-solving methodologies; Experience with statistical tools (JMP, Minitab, etc.); Background in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), or Physical Vapor Deposition (PVD); Background in Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP); Knowledge of material synthesis and material characterization.