Vice President, Platform Engineering

The VP of Engineering for Platforms will lead the engineering organization responsible for designing, developing, and scaling next-generation, high-density hardware storage architectures. This role owns the execution of the storage platform roadmap, spanning ultra-dense JBODs and storage servers. The role manages a cross-functional department of hardware, firmware, and manufacturing operations engineers to deliver reliable, highly serviceable, and cost-efficient hardware storage solutions optimized for hyperscale datacenters and modern AI workloads.

Responsibilities

Drive the development lifecycles of next-generation high-capacity storage enclosures from initial concept through architecture, board bring-up, validation, and global high-volume manufacturing; Build, manage, and mentor a high-performance team of engineering directors, managers, and principal architects across electrical, mechanical, firmware, and operations domains; Oversee manufacturing engineering and operations teams, own product delivery through Contract Manufacturing (CM) execution, and act as the executive escalation point; Drive early-stage prototype NPI builds, factory bring-up, and EVT/DVT/PVT validation while establishing processes for high-volume mass production; Lead technical engagements and design reviews with silicon suppliers, component vendors, and CM partners to enforce DFM, DFA, and cost-reduction targets; Oversee departmental budget, capital allocation for lab instrumentation, headcount planning, factory tooling costs, and organizational risk mitigation strategies; Demonstrate deep understanding of customers and their data center ecosystems to inform technical product development; Provide directional oversight on multi-layer PCB design incorporating high-speed interfaces such as PCIe Gen 6/7, SAS (12G/24G), SATA, and high-speed SERDES; Ensure physical architectures balance high disk/flash densities with thermal dynamics, airflow constraints, and Power Distribution Networks (PDN)

Requirements

Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Industrial/Manufacturing Engineering, or a highly related technical field; 15+ years of hands-on engineering experience, including 8+ years in multi-layered senior management roles, leading teams of 50+ employees geographically spread in US and Asia, directly handling enterprise hardware platforms and NPI-to-mass-production lifecycles; Proven track record of delivering programs on-time and successful ramp into high volume production; 8+ years of experience working directly with tier-1 & tier-2 enterprise customers, including customer interface to understand requirements, propose solutions and architecture, and establish long-term engineering/exec-level relationships; Proven track record of managing tier-1 global Contract Manufacturers (CMs) or Original Design Manufacturers (ODMs) to deliver hardware at hyperscale volumes; Outstanding executive communication skills with a proven capability to articulate complex technical trade-offs (e.g., design tolerance vs. manufacturing yield vs. BOM cost) directly to board-level stakeholders; Track record of transforming engineering organizations through stronger methodology, platform reuse, schedule predictability, and improved first-pass execution; Experience operating in a global company environment with distributed teams across the Americas, Asia, and EMEA

Benefits

Paid vacation time; paid sick leave; medical/dental/vision insurance; life, accident and disability insurance; tax-advantaged flexible spending and health savings accounts; employee assistance program; supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity; tuition reimbursement; transit; the Applause Program; employee stock purchase plan; WD Savings 401(k) Plan; eligibility for bonuses under the Short Term Incentive Plan or Sales Incentive Plan; possible participation in the annual Long-Term Incentive (LTI) program