2026/02: HW Developer for Electronic Control Unit

Hardware Design Engineer – LV/HV Power Electronics & Inverters Role Summary Responsible for the end-to-end design and development of low-voltage and high-voltage power electronics hardware, including DC/DC converters and low-power inverter systems, covering analog/digital circuitry, simulations, PCB design support, testing, and compliance with automotive standards.

Responsibilities

Design analog and digital circuits using microcontrollers, op-amps, transistor families, and mixed-signal interfaces; Develop low-voltage DC/DC converters and high-voltage wide-input flyback converters (multiple outputs, isolation, transformer design, feedback); Design B6 bridge HV inverter (1200V) using SiC MOSFETs, gate drivers, HV filter protection, thermal design, PCB stack-up and insulation; Perform worst-case design calculations, derating, stress and power-loss analysis; Conduct PSpice/LTspice simulations (time-domain, frequency-domain, Monte Carlo); Create schematics in Zuken CR8000/OrCAD and support PCB layout (Allegro/PADS) with considerations for EMC, PCB stack-up, PCB track characteristics, and manufacturability; Capture/analyze customer requirements using IBM DOORS NG and follow ASPICE processes; Support hardware testing, debugging (Design of experiments), and validation; Ensure compliance with ISO 16750, ISO 7637, CISPR 25, ISO 11452, and reinforced insulation standards (12V/24V/400-800V).

Requirements

Analog & mixed‑signal circuit design using MCUs, op‑amps, BJTs/MOSFETs, ADC/DAC interfaces, and standard communication interfaces (SPI, I²C, UART, CAN); Power electronics design experience with low‑voltage DC/DC converters and wide‑input isolated flyback converters, including magnetics, feedback, and multi‑output regulation; High‑voltage inverter design expertise (up to 1200 V) with SiC MOSFETs, isolated gate drivers, protection concepts, thermal design, and reinforced insulation; Strong analytical capability in worst‑case design, derating, stress analysis, and power‑loss/thermal calculations; Proficiency in circuit simulation using PSpice/LTspice for transient, AC (loop stability), and Monte‑Carlo/worst‑case analysis; Schematic design and PCB layout support using Zuken CR8000/OrCAD and Allegro/PADS, with focus on EMC, high‑voltage spacing, stack‑up, and manufacturability; Requirements engineering experience using IBM DOORS NG with adherence to ASPICE development and change‑management processes; Hands‑on hardware debugging and validation skills, including structured root cause analysis (DoE) and lab‑based troubleshooting; Knowledge of automotive standards and compliance, including ISO 16750, ISO 7637, CISPR 25, ISO 11452, and insulation requirements for 12 V/24 V/400–800 V systems; Electronics (BE/ME); >6 years of experience