Automotive High-Speed Hardware Design Engineer

Responsibilities

Lead hardware design and development for ADAS, Cockpit, and Connectivity ECUs, from concept to production; Design high-speed digital boards with advanced SoCs, DDR4/DDR5, LPDDR interfaces, PCIe, Ethernet (RGMII/SGMII/RMII/10G), USB, MIPI CSI/DSI, and SerDes; Perform schematic design, component selection, and BOM optimization ensuring automotive-grade reliability and cost efficiency; Conduct Signal Integrity (SI) and Power Integrity (PI) analysis for critical high-speed signals and power rails; Support thermal design and validation, collaborating with mechanical and thermal engineers to ensure performance under harsh automotive conditions; Ensure ASIL-D compliance (ISO 26262) for safety-critical designs; participate in FMEA, FMEDA, and safety architecture reviews; Interface with camera, radar, LiDAR, and sensor fusion modules, ensuring signal quality, timing, and synchronization; Collaborate with PCB layout engineers for constraint-driven designs (impedance, stackup, crosstalk, EMI/EMC); Drive hardware validation and bring-up, including board-level testing, debugging, and root-cause analysis; Work with cross-functional teams (System, Software, Validation, Manufacturing, EMC) through design verification and PPAP stages; Support DFMEA, DFx (DFM, DFT, DFA) activities to ensure manufacturability and reliability; Create design documentation, validation reports, and participate in technical reviews and customer discussions

Requirements

Bachelor’s or Master’s Degree in Electronics, Electrical, or related engineering field; 5–9 years of hands-on experience in automotive hardware design; Proven experience with SoC-based board design (e.g., NVIDIA, Qualcomm, Renesas, TI, NXP, Infineon AURIX); Strong understanding of ADAS, Cockpit, and IVI architecture including sensor and compute domains; Expertise in high-speed design (DDR4/5, PCIe, MIPI, Ethernet, USB 3.x, LVDS, SerDes); Experience with SI/PI analysis tools (e.g., HyperLynx, Sigrity, Ansys, Cadence); Knowledge of Automotive Safety (ISO 26262 – ASIL B to D compliance); Familiarity with EMI/EMC standards (CISPR 25, ISO 11452) and compliance testing; Understanding of thermal design, power sequencing, and power distribution; Experience in camera/radar interface and sensor fusion hardware design; Proficiency in schematic tools (Altium, Cadence Allegro, Mentor DxDesigner, Zuken CR8000); Hands-on experience with hardware bring-up, debugging, and lab instruments (oscilloscope, logic analyzer, power analyzer, etc.); Excellent analytical, communication, and documentation skills; B.E, Electronics Engineering; Schematic/PCB: Zuken, Altium Designer, Cadence Allegro, Mentor Graphics; Simulation: HyperLynx, Ansys SIwave, Sigrity, SPICE, ADS; Compliance & Debug: Oscilloscope (≥20GHz), Vector CANoe, Power Analyzer, JTAG; Documentation: PDM/PLM systems, Jira, Confluence

Nice to have

Experience with ASIL-D compliant ECU development; Exposure to Ethernet TSN, CAN-FD, LIN, FlexRay and in-vehicle communication networks; Knowledge of thermal simulation and mechanical integration; Familiarity with AI/ML accelerator SoCs used in perception and fusion ECUs; Experience working with global OEMs and Tier-1s on production projects