Dir, Package Design Engineering

Dimensions

- Global responsibility across Asia
- Internal factories and multiple OSAT partners
- Executive ownership of HVM sustaining.
- Global customer support
- Lead geographically distributed engineering teams
- Own manufacturing excellence, supplier governance, cost reduction, and HVM sustaining

Responsibilities

Lead the global Packaging Sustaining Engineering organization supporting high-volume semiconductor manufacturing across internal assembly sites and OSAT partners throughout Asia, ensuring manufacturing excellence, customer satisfaction, yield, quality, reliability, cost competitiveness, and strategic supplier management.; Responsible for Japan Assembly Engineering (PAE1) and Malysia Assembly Engineering (PAE3) Groups.; Work with Package Development Group (NPI). Takeover qualified products from NPI for mass production.; Work with Supply Chain Management (SCM). Address Capacity or Material supply issues to secure on time delivery.; Work with OSATs and QA to address assembly related quality or customer RMA issues.; Work with Procurement, SCM, and Package Development to define Renesas OSAT strategy.; Do the industry benchmarking on substrate suppliers, material suppliers, equipment suppliers, and competitors. Do the literature survey and perform competitive analysis.; Address PCN and PDN issues.; Publish Weekly Assembly Engineering Statistics. Define action plans for yield improvement, cost reduction, cycle time reduction, and continuous improvement.; Lead Manufacturing Sustaining Engineering for all released production packages.; Own Customer RMA, failure analysis, RCA, CAPA and customer communications.; Drive Yield Improvement and Process Excellence using SPC, DOE, PFMEA and analytics.; Lead Cost Optimization through process, material and manufacturing improvements.; Own Product Change Notification (PCN) planning, qualification and implementation.; Lead Material Review Board (MRB) and disposition of abnormal materials/products.; Manage OSAT suppliers, supplier audits, scorecards and technology alignment

Requirements

15+ year Assembly Engineering experience; MS or Ph.D. degree, Material Science or Mechanical Engineering; Excellent communication, documentation, and schedule management skills; Excellent leadership, communication and customer management skills.; Solid OSAT management experience; Extensive experience supporting high-volume manufacturing across multiple semiconductor package platforms.; Automotive Packaging experience; Assembly experience on various packages. FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D.; Package substrates experience on MSAP, ETS, Tenting, and ABF substrates.; SMT process, Warpage, and Board Level Reliability testing experience; Familiar with Industry standards. JEDEC, IPC, Automotive quals, and others; Familiar with SPC, 8D, RCA, SYL/SBL.