Źródło:
Engineer, Packaging Engineering (Mechanical Design)
Sandisk
Batu Kawan, Malezja
Data publikacji: 04.09.2026
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
Responsibilities
As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.; The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.; The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.Requirements
B.S. in Mechanical Engineering plus 5 years, of relevant industry experience; Solid knowledge through academic coursework or experience required in Mechanical design; Proficiency in CAD software (e.g. SolidWorks, Autocad); Knowledge of engineering drafting standards and tolerance analysis; A strong background in mechanical design with electronic consumer product design a plus; Knowledge of plastic injection molding and metal fabrication; Demonstrated strong work ethic; Prior history working with outside suppliers and contract manufacturers; Ability to work in a team environment and interact with others to release products on schedule; Prior retail packaging design a plus; Strong oral and written communication skills.Jak aplikować
Aplikuj online: https://www.jobs.pl/oferta/100041591/aplikuj
JOBS.pl · https://www.jobs.pl/engineer-packaging-engineering-mechanical-design-oferta-100041591

















