Hardware Architect

Automotive High-Speed Hardware Design Engineer. We are seeking an experienced Automotive High-Speed Hardware Design Engineer to lead the design and development of advanced electronic control and compute platforms for ADAS, Cockpit, IVI, and Connectivity systems. The role involves working on SoC-based, ASIL-D compliant hardware, with focus on high-speed interfaces, thermal design, signal and power integrity (SI/PI), and multi-sensor integration (camera, radar, LiDAR, fusion). The candidate will collaborate closely with system architects, PCB designers, mechanical, and software teams to deliver production-grade hardware solutions for next-generation automotive platforms. Key Responsibilities: Lead hardware design and development for ADAS, Cockpit, and Connectivity ECUs, from concept to production. Design high-speed digital boards with advanced SoCs, DDR4/DDR5, LPDDR interfaces, PCIe, Ethernet (RGMII/SGMII/RMII/10G), USB, MIPI CSI/DSI, and SerDes. Perform schematic design, component selection, and BOM optimization ensuring automotive-grade reliability and cost efficiency. Conduct Signal Integrity (SI) and Power Integrity (PI) analysis for critical high-speed signals and power rails. Support thermal design and validation, collaborating with mechanical and thermal engineers to ensure performance under harsh automotive conditions. Ensure ASIL-D compliance (ISO 26262) for safety-critical designs; participate in FMEA, FMEDA, and safety architecture reviews. Interface with camera, radar, LiDAR, and sensor fusion modules, ensuring signal quality, timing, and synchronization. Collaborate with PCB layout engineers for constraint-driven designs (impedance, stack

Responsibilities

Lead hardware design and development for ADAS, Cockpit, and Connectivity ECUs, from concept to production; Design high-speed digital boards with advanced SoCs, DDR4/DDR5, LPDDR interfaces, PCIe, Ethernet (RGMII/SGMII/RMII/10G), USB, MIPI CSI/DSI, and SerDes; Perform schematic design, component selection, and BOM optimization ensuring automotive-grade reliability and cost efficiency; Conduct Signal Integrity (SI) and Power Integrity (PI) analysis for critical high-speed signals and power rails; Support thermal design and validation, collaborating with mechanical and thermal engineers to ensure performance under harsh automotive conditions; Ensure ASIL-D compliance (ISO 26262) for safety-critical designs; participate in FMEA, FMEDA, and safety architecture reviews; Interface with camera, radar, LiDAR, and sensor fusion modules, ensuring signal quality, timing, and synchronization; Collaborate with PCB layout engineers for constraint-driven designs (impedance, stack

Requirements

B-Tech/M.Tech; 7-10 years