High-Speed I/F Subsystem Design Leader

【【Background of the Recruitment】】

As vehicles become increasingly electrified and intelligent, automotive SoCs are now positioned as a central technology supporting vehicle performance and functionality.

The R-Car series has continued to grow as a large‑scale SoC through the advanced integration of numerous and diverse IPs, including CPU, memory, high‑speed interfaces, AI, video, functional safety, and security.

Our organization is responsible not only for in‑house IP development but also for the selection, integration, and implementation of external IPs, making the strengthening of technical leadership in core areas such as the High-Speed I/F subsystem a key focus.

Against this background, we are seeking technical leaders who can define design direction, make sound technical decisions, and move development forward in collaboration with surrounding teams and IP vendors.

This role offers an opportunity for engineers who wish to drive development with a strong technical foundation while preparing to take on broader responsibilities in the future.

【Job Description】

※The full details regarding your position scope as well as any future potential changes in work location and job scope will be provided during the interview process.

【WANT】

- Experience taking a technical lead role at subsystem or IP level (e.g., leading design reviews, guiding technical discussions).
- Experience in SoC integration involving PCIe, UCIe, USB and UFS-related components.
- Knowledge of power domain separation and physical implementation considerations (e.g., P&R).
- Experience in automotive SoC development or design/verification with functional safety or reliability considerations.
- Experience in technical communication and coordination with overseas sites and/or third‑party IP vendors.
- Japanese language proficiency at a conversational level

Responsibilities

Play a key role in specification definition and architectural study of the High-Speed I/F subsystem for automotive SoCs (R-Car series).; Work on the High-Speed I/F subsystem including PCIe, UCIe, USB and UFS-related areas, and organize design directions from a subsystem-level optimization perspective while owning a primary technical area.; During logic design and verification phases, identify and structure technical issues, contribute to design decisions, and help drive development forward.; Consider constraints such as power, performance, and reliability, and make technical judgments consistent with overall SoC requirements.; For integrated third‑party IPs, communicate with IP vendors to confirm specifications, clarify constraints/assumptions, and support issue resolution.; Collaborate with design teams in India and Vietnam and with IP vendors, working in English within a global development environment.

Requirements

Hands-on experience in at least one of PCIe, UCIe, USB, UFS, including specification study, design, verification, or performance evaluation:; Ability to organize design directions and key discussion points based on requirements and share them with stakeholders.; Understanding of the logic design and verification flow, and experience actively participating in technical reviews/discussions.; Communication skills to collaborate across teams and contribute to technical consensus building.; Willingness and ability to communicate in English for technical meetings and specification reviews.