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HPC Principal, Applications Engineer (CPU)

Renesas Electronics Kokubunji, Japonia
Pełny etat Praca stacjonarna

Data publikacji: 03.09.2026

Renesas keeps key position in worldwide Automotive MCU market since long time, and aims to grow more for the future as a solid ground of Renesas business. CPU is one of the key IP to define competitiveness of MCU and market requirements such as Power, Performance, Area, and standardization with Eco system are rapidly changing with SDV trend in Automotive. We are looking for new colleague who building competitive CPU subsystem solutions as Application engineer with us.

【Job Description】

a) CPU platform sub system architect with KPI definition

b) PPA benchmark leading (RTL level)

c) Define the suitable design to target application

d) Creating System requirement document

Requirements

【Must-Have】; ・Knowledge of Micro architecture for CPU and Bus system; ・RTL design (HDL/VHDL design, Simulation, Synthesis) experience: 10years; ・Implementation design (Timing design, Layout) : 5years; ・Software Design by Assembler and C lang : 3 years; 【Nice-to-Have】; ・CPU related design: 5 years; ・ARM/RISC-V architechter knowledge
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