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Data publikacji: 03.09.2026
Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world-leading MCUs, SoCs, analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you.
Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world.
We are seeking a Senior Power Module Design Engineer to own the end-to-end electrical design of high-density power modules. These products target next-generation GPU and AI accelerator core power delivery with extremely high current density, fast transient response, and tight thermal and reliability margins. This is a hands-on design role with full ownership from architecture definition through module validation.
Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world.
We are seeking a Senior Power Module Design Engineer to own the end-to-end electrical design of high-density power modules. These products target next-generation GPU and AI accelerator core power delivery with extremely high current density, fast transient response, and tight thermal and reliability margins. This is a hands-on design role with full ownership from architecture definition through module validation.
Responsibilities
Design high-current, high-density power modules for CPU/GPU/xPU core power and AI server power delivery applications.; Collaborate with package engineers and IC designers to develop advanced packaging solutions that integrate ICs, inductors, and capacitors into a high-density module.; Conduct PDN extraction for the module package to assess power path losses and switch-node ringing.; Design inductors per module and silicon pinmap. Work with inductor vendors to bring concept designs into real products.; Build and run module thermal models to ensure all components remain below maximum operating temperatures.; Work with the validation team to debug power modules and perform bench characterization, including efficiency, thermal, and transient performance.; Support design-for-manufacturing (DFM) and design-for-test (DFT) activities.Requirements
BSEE or MSEE with 5+ years of hands-on power electronics design experience.; Strong experience designing high-current, high-frequency DC-DC converters, especially multiphase buck architectures.; Direct experience designing power modules, VRMs, or highly integrated power solutions is strongly preferred.; Deep understanding of power stage design and magnetics for high-current applications.; Hands-on experience in PCB layout for high-current-density and high-frequency applications.; Proficiency with design and simulation tools:; PCB layout: Cadence/Altium Designer; Circuit simulation: SIMPLIS / SIMetrix; PDN extraction and magnetic design: Q3D / PowerSI / Maxwell; Thermal simulation: Flotherm / Icepak; Proven ability to debug complex power circuits through lab measurement and root-cause analysis.; Ability to collaborate effectively across IC design, packaging, reliability, and manufacturing teams.Jak aplikować
Aplikuj online: https://www.jobs.pl/oferta/100087105/aplikuj
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