Źródło:
Senior Engineer, Packaging Engineering
Sandisk
Batu Kawan, Malezja
Data publikacji: 29.08.2026
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
Responsibilities
BOP (Back‑End of Process) AOI processes include SBA, Laser Marking, Laser Cutting, PKG saw and Painting development for LGA/BGA product assemblies; Develop and optimize new BOP process recipes to achieve high capability for new products; Collaborate with the material team on evaluation of new package‑related materials; Work with the Packaging team on new product design, evaluation, and introduction; Partner with the Pathfinding team to achieve leading PKG technology targetsRequirements
Bachelor or above, major in Automation, Mechatronics, Materials Science and Technology, etc; 1-3 years’ process experience in Assembly; Good communication skill; Willing to work under certain pressure and team work spiritNice to have
Strong knowledge at assembly process; Good at AutoCAD, 3D drawing, Animations, Solidworks, JMP (or other similar statistic software, Spot-fire) etc; Familiar with one of programming language will be a plusJak aplikować
Aplikuj online: https://www.jobs.pl/oferta/100003486/aplikuj
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