【Takasaki/Toyosu】Principle Package Engineer

1. Package Development & NPI Support

- Support package development activities for new Power MOSFET products including:

TOLL / TOLG / TOLT

Bottom-side cooled (BSC)

Dual-side cooled (DSC)

Top-side cooled (TSC)

. Advanced lead frame and clip-bond packages

- Define package requirements and specifications for new product development.
- Support package qualification and AEC-Q101 compliance activities.
- Drive package-related activities during NPI and product transition.

2. Thermal & Mechanical Engineering

- Perform thermal analysis and package characterization.
- Conduct thermal resistance and thermal impedance measurements.

- Evaluate package reliability associated with

Power cycling

Thermal cycling

Solder joint reliability

Mechanical stress

- Support package-level failure analysis and root cause investigation.

3. Package Benchmarking & Technology Survey

- Benchmark competitor power package technologies.
- Analyze package construction, materials, and performance.
- Identify technology trends and recommend future package roadmaps.
- Conduct package reverse engineering and technical assessments.

4. Simulation & Modeling

- Develop and maintain thermal simulation models.
- Support electrical and mechanical package simulations.
- Correlate simulation results with measurement data.
- Collaborate with system engineers on thermal optimization and system-level performance evaluation.

- Support customer inquiries regarding

Thermal performance

Package selection

Reliability considerations

- Work with Application Engineering teams on customer design support.
- Develop package-related technical documentation and application notes.

- Coordinate package activities with

Design Engineering

Product Engineering

Reliability Engineering

Manufacturing

Marketing

External package suppliers

- Participate in product definition reviews and technical decision-making.

Thermal simulation tools

- ANSYS Icepak

- ANSYS Mechanical

- FloTHERM

Familiarity with

- Automotive semiconductor requirements

- AEC-Q101

- APQP/PPAP

Requirements

Thermal characterization and analysis; Semiconductor package design fundamentals; Reliability testing and qualification.; Failure analysis techniques.; Statistical data analysis.; PCB and thermal design knowledge.