Product Marketing Manager 3D IC

Siemens EDA is seeking a Product Marketing Manager for the Innovator3D IC product family within the Electronic Board Systems (EBS) Group. The role focuses on identifying market trends, shaping go-to-market strategies, creating marketing programs and sales materials, and supporting product launches for 2.5/3D IC heterogeneous integration software solutions.

Responsibilities

Identify market trends, opportunities, and competitive threats to shape product and go-to-market strategies that maximize corporate revenue; Define key product messages, positioning, and branding strategies to enhance market perception and adoption; Leverage key industry themes and customer needs to create impactful marketing programs, customer collateral, sales materials, and field marketing campaigns; Develop and execute brand and segment strategies that align with divisional initiatives and corporate goals; Drive marketing programs that establish Siemens EDA and the Innovator3D IC product family as industry thought and technology leaders; Support product launches, ensuring the successful adoption and continued growth of Innovator3D IC product family in the market; Collaborate with Market Development and Product Strategy & Technology teams to develop and refine messaging, pricing, packaging, and promotional plans; Collaborate with other Siemens EDA technology divisions to develop, message, position and promote a comprehensive 3D IC solution stack; Work closely with market development and sales teams to craft compelling messaging for new solutions, product releases, and marketing campaigns; Monitor and analyze market trends and competitive intelligence to inform strategic decision-making; Develop and execute event strategies for key trade shows, industry conferences, and customer events to enhance brand visibility and lead generation

Requirements

Bachelor's degree in electrical engineering or a related field; 5+ years of experience in product marketing, or a related role within the electronics industry, in the domain of IC design, IC package design or printed circuit board; A firm understanding of the principles and challenges associated with the heterogeneous integration of multiple chiplets into a high-performance substrate platform including prototyping, pathfinding, detailed design, Multiphysics analysis and manufacturing signoff; Strong communication and storytelling skills with the ability to translate technical features into value propositions; Proven ability to develop and execute marketing campaigns; Experience working cross-functionally with sales, product management, and business development teams; Strong analytical and problem-solving skills with the ability to interpret market data and customer insights; Ability to travel as needed for industry events, conferences, and customer engagements

Nice to have

Masters degree

Benefits

Flexibility to choose between working at home and the office; Great benefits and rewards